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Indium Corporation’s Solder Thermal Interface Materials radically improve: •Heat dissipation efficiency in electronic devices •Thermal conductance for high power devices – with densities in excess of 1000 watts •End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases •Portable device battery performance – by reducing thermal resistance and cooling fan size •Portable device use profile – by reducing heatsink size and mass •Compliance with RoHS while accommodating step soldering requirements
Indium Corporation has solutions for:
Confidentiality Indium Corporation recognizes the Importance of confidentiality in the design of thermal interface solutions. As a trusted partner, our engineers will work with you to help you find the right solution for your thermal interface problems. We can help you find the right alloy for performance and the best solder form for ease of assembly.
Applications Some non-confidential applications include: Semiconductor Integrated Circuits
