INDIUM 6.4R Water-Soluble Solder Paste

INDIUM 6.4R Water-Soluble Solder Paste View Large Image
6.4R

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. This solder paste delivers outstanding stencil printing performance, with long stencil life and excellent response-to-pause. Indium6.4R replaces Indium6.4, our former top water-soluble solder paste.

Indium6.4R provides superior wetting to a variety of surface finishes and exhibits the best voiding performance: fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs and BTCs (QFNs, D-Paks, LGAs, etc.)

Features:

  • Lowest voiding water-soluble flux for solder paste:
    • Reduced largest voids
    • Fewer voids
    • Minimized voiding overall
    • For BGA, CSP, and bottom termination components such as QFNs
  • Exceptional printing process window:
    • Excellent response to pause
    • Long stencil life (>8 hours in controlled environment)
    • Prints consistently at a wide range of speeds
  • Wide reflow process window for profiling
  • Excellent wetting on a variety of surface finishes
  • Maintains tack over time
  • Suitable for SnPb eutectic alloys as well as Pb-free alloys
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INDIUM 6.4R Water-Soluble Solder Paste

INDIUM 6.4R Water-Soluble Solder Paste

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